The heat dissipation cools to large and has a number of heat dissipation holes to the stability of the machine during operation and duration of the material.
Exquisite layout, more reasonable space. Reasonable interior design, compatible with THN-TX motherboard.
SECC material with a thickness of 0.7 mm, materials, hot-dip galvanized steel plate, with high resistance, toughness and deformation.
Suitable for motherboard MINI-ITX ultra-thin board (less than 17 x 17 cm), only supports motherboards with self-powered DC IN.