The heat dissipation design cools at high speed and has a large number of heat dissipation holes to ensure the stability of the machine during operation and the service life of the equipment.
SECC material thickness 0.7mm, selected materials, hot dipped galvanized steel plate, with high corrosion resistance, toughness and no deformation.
Exquisite layout, more reasonable space. Reasonable inner design, compatible with THN-TX motherboard.
Suitable for motherboard ultra-thin MINI-ITX board (less than 17 x 17 cm), only supports motherboards with self-powered DC IN.