The distributed arrangement of the two pure copper heat pipes is more conducive to transfer the heat emitted by the CPU to the entire fin, and the heat conduction is faster.
Use of pure aluminum material conjoined heat dissipation group fins, disperse conduction, effectively reduce heat accumulation.
Adopts the FIN process to keep the heat sink fins at equal spacing, which enhances the firmness of the heat sink and the heat sink.
The flat copper bottom design has no obstruction contact with the CPU, which is more conducive to the heat dissipation of the CPU.
Matched with LED light‑emitting lamp beads, and the double‑layer three‑dimensional effect design, and the light‑emitting effect is better.