The heat dissipation cools to large and has a number of heat dissipation holes to ensure the stability of the machine during operation and the duration of material.
SECC material with a thickness of 0.7 mm, selected materials, hot-dip galvanized steel plate, with high corrosion resistance, toughness and deformation.
Exquisite layout, more reasonable space. Reasonable interior design, compatible with THN-TX motherboard.
Suitable for motherboard MINI-ITX ultra-thin board (less than 17 x 17 cm), only supports motherboards with DC IN -powered.