SECC material with 0.7MM thickness, materials, hot-dip galvanized steel plate, with high resistance, toughness and no deformation.
The heat dissipation design cools at high speed, and has a number of heat dissipation holes to the stability of the machine during operation and the life of the hardware.
Exquisite layout, more reasonable space. Reasonable interior design, compatible with THN-TX motherboard.
Suitable for motherboard MINI-ITX ultra-thin board ( 17 x 17CM), only supports motherboards with DC IN -powered.